The properties of KetaSpire® PEEK and Torlon® PAI enable them to be used extensively throughout the semiconductor industry, especially where high-temperature processing is required. They are dimensionally stable at high and low temperatures, provide clean and contaminant-free surfaces, and are not affected by harsh chemicals, strong acids, or solvents.
These ultra high-high performance polymers are particularly suited to replace metal parts for wafer handling, bearing surfaces, processing vessels, parts carriers, and IC test equipment sockets & handlers. For more information, select the link above.
- Semiconductor fabrication and testing
- CMP rings
- Wafer carriers
- Etch rings
- Pins and fasteners
- In-process trays and transport media
|KetaSpire® PEEK||Torlon® PAI||Solef® PAI|
|High purity, low leachables/extractables (ex Cl-)||Very good||Very good||Excellent|
|Outgassing, residual solvents||Very good||Very good||Excellent|
|Low moisture adsorption||Very good||Very good||Excellent|
|Acids||Very good||Very good||Excellent|
|Bases||Very good||Very good||Excellent|
|Organics||Very good||Very good||Excellent|
|Elongation, ductility||Good||Good||Very high|