Coatings

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KetaSpire® PEEK powders used in water-borne coatings and powder coatings provide excellent strength, durability, and chemical resistance for demanding applications in chemical processing, oil and gas, aerospace, semiconductor, healthcare, transportation, and other industrial uses.

Solvay’s PEEK powders are based on KT-820, a low melt flow grade, and KT-880, a high melt flow grade. Products include fine (FP), super-fine (SFP) and ultra-fine (UFP) powders with nominal median particle sizes ranging from 10 microns to 30 microns.

  • KetaSpire® KT-820: Low melt flow; FP, SFP, UFP
  • KetaSpire® KT-880: High melt flow; FP, SFP, UFP

In addition to coatings, KetaSpire® PEEK SFP and UFP powders are used in the solventless pre-impregnation of continuous carbon fiber and other continuous fiber reinforcements, with PEEK resin as a thermoplastic matrix. This is achieved through an electrostatic powder coating process and the finest possible particle size allows for good coating, even distribution, and uniform melting of the PEEK resin around the reinforcement.

Contact your Coatings representative for assistance.

High-Temperature Binders

Torlon® AI (amide-imide) powders are used as high-temperature binders that promote coating adhesion to the substrate. Typical applications include coatings for electrical wires, corrosion prevention, non-stick cookware and industrial low-friction applications.

  • Torlon® AI-10: High-temperature binder for non-stick coatings
  • Torlon® AI-30: Water-soluble analog of Torlon® AI-10
  • Torlon® AI-50: Water-soluble coarse powder

Powders for Coatings and Binders

 KetaSpire®
KT-820/880
Ultra Fine
KetaSpire®
KT-820/880
Super Fine
KetaSpire®
KT-820/880
Fine
Torlon®
AI-10
Torlon®
AI-30
Torlon®
AI-50
Water DispersibleYesYesNoNoYesYes
Particle Size, D5010μ30μNot defined   
Chemical ResistanceExcellentExcellentExcellentVery goodVery goodVery good
Thermal ResistanceGoodGoodGoodExcellentExcellentExcellent